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Chemtronics 60-6-5 Desolder Braid, No Clean Flux, .210"W x 5'L
- HMC# 60-6-5
- MFR# 60-6-5
Overview
- Minimizes the risk of heat damage to components and circuit boards
- Optimized construction for faster wicking and heat transfer
- Requires little or no post solder cleaning
- No corrosive residues
- Halide free
Chemtronics 60-6-5 Soder-Wick® No Clean SD is designed for today's heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. To desolder, simply place wick on solder joint and place tip of hot iron on top of wick. As solder becomes molten, the color of the wick will change from copper to silver. Remove wick and iron from solder joint simultaneously once color change has stopped. Soder-Wick® No Clean SD provides fast and safe desoldering without leaving behind harmful flux residues. Chemtronics 60-6-5 desoldering wick is packaged in an ESD-safe static dissipative bobbin.















