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The Microcare MCC-BGA is a powerful, water-based, slow-drying cleaner which removes all types of solder paste, uncured chip bonders and inks. Great on SMT stencils, webbing, frames and misprinted boards. Safe on all metals, synthetics, plastics and elastomers. No residues. Low aroma. Noncorrosive, generally nontoxic, completely ozone-safe, with a low VOC content and no global warming potential. Safe for manual cleaning, ultrasonic cleaning systems and dip tanks. Not suitable for use in the stencil printers themselves. Refillable.
Note: Regulated Material - Non-Hazardous When Shipped Ground Service