Kester Solder Paste, Sn63/Pb37 Tin/Lead Alloy, No-Clean Easy Profile 256HA (high activity), 500-gm. Jar

• For Stencil Printing Applications

Specifically formulated for wetting to difficult-to-solder-to component and board metallizations. Consistent print volume regardless of process parameters and 0201 application capable. Capable of printing downtimes of up to 90 minutes with an effective first print down to 20 mils. Maintains its activity and printing characteristics for up to 8 hours without any shear thinning. Compatible with enclosed print head systems. Tin/lead alloy: Sn63/Pb37. Powder mesh size: -325/+500 (Type 3). Metals content: 90%.

Kester solder pastes are developed specifically to meet the requirements of surface mount applications on both standard glass-epoxy and hybrid circuitry. Rheological properties are fashioned to work smoothly with common dispensing methods while still meeting the restrictions of printed circuit pattern densities. Kester solder pastes can be used with a broad range of reflow techniques including infra-red, hot belt, or vapor phase. They contain high quality solder powder which is spherical, consistently sized, low in oxide content, and made from pure virgin metals. The solder power is suspended in flux vehicles which place special emphasis on eliminating solder balls and other common defects, while maintaining a minimum effect on electronic reliability.

Note: Solder paste jars and cartridges must be purchased in multiples of 20 units (standard package quantity).