Provides superior thermal transfer to the joint, effectively reflowing solder and then quickly and efficiently removing all solder. State-of-the-art handpiece can be adjusted from pencil to gun with a simple press of a button. Operators can find the most comfortable and efficient position to tackle the rework challenge. Paper solder collection chamber and filter system is quick and easy to change, and provides low cost maintenance. Two MFR desoldering systems are available. Model MFR-DSX requires 65 psi of shop air, while self-contained Model MFR-DSI features an internal vacuum pump that generates 22" Hg of vacuum pressure. Both systems are ESD-safe and meet Mil-Specs. They operate on 100/120VAC and include a two-port 90W power supply, 50W desoldering handpiece (without desoldering tip), workstand with sponge, and cartridge removal pad.

MFR Series systems feature patented SmartHeat® conduction technology that uniquely senses the exact thermal requirement for each solder joint and responds by delivering the precise amount of thermal energy at the rate required to create a reliable connection. The result is a high degree of control without resorting to higher tip idle temperatures required by conventional ceramic heater technologies. Consequently, the risk of component or circuit board damage is minimized, especially important with the greater thermal demands required by lead-free applications. Lightweight handpieces with an optimum tip-to-grip distance add comfort and control, especially for fine pitch applications. An impressive range of heater tip and tip cartridge geometries ensures easy access and precision performance. "Auto Standby" and "Auto Off" functions can be programmed to activate on different timing to maximize tip life, especially when working on a lead-free process. A built-in motion detector then brings the unit back to life when the handpiece is lifted from the cradle.