UltrapureŽ K100LD, a low-cost (silver-free) lead-free bar solder, is a near-eutectic tin/copper alloy with the inclusion of metallic dopants to control the grain structure within the solder joint. It also has a slower rate of copper dissolution than competitive SnCuNi alloys, which minimizes pot maintenance, maintains consistent soldering performance, and improves reliability. K100LD compares favorably to other low-cost, lead-free alloys of tin and copper in terms of wetting and flow characteristics, providing users with optimal soldering performance and minimal defects. Besides offering the lowest dissolution of copper from boards and components of any lead-free alloy, K100LD provides numerous benefits including bright, smooth solder joints with no visible shrinkage effects, excellent through-hole penetration and topside fillet with virtually no bridging, reduced leaching of solder pot materials, and a low dross rate for added cost savings to the assembler. Melting temperature is 441°F.

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