Unlike conventional convection systems, the Metcal QX2 provides simplified controls and automation, reducing operator training requirements. The system controller is moveable to suit your preferences and simplifies operation with its push-button configuration. Set-up is fast and easy, requiring no special tools, fixturing, or testing. The need for shielding is minimized through the use of focused convection nozzles, which direct heat exactly where it is needed. Nozzles can be changed in seconds with a simple quick-release system. An easy-to-use, 6" x 6" underboard preheater is available to evenly heat boards from 90°C - 120°C and prevent warping during the rework of large components and multilayered boards. The self-centering board holder can accomodate PCBs from 2" x 2" to 14" x 18".To maintain greater process control, the heater exhaust temperature is held constant. The temperature setpoint is low to minimize thermal stress. Should it be necessary to change the setpoint to accomodate process changes, such as new soldering alloys, the QX2 incorporates a lockout code allowing authorized personnel to reprogram it. To vary heating all that is required is that the airflow level be adjusted. This makes optimizing heat delivery very simple. During the removal cycle, the vacuum pick-up automatically lifts the component from the board when the solder reflows, and then shuts off the heat. The time used in the removal cycle is stored and displayed as a guide for establishing the minimum time to reattach a similar component. Temperature range is 250°C - 450°C. Air flow rate is 20-50 liters/min. Unit operates on 90-132 VAC. A wide range of easily interchangeable hot air nozzles are available upon request.