• Low Solid, No-Clean Flux
• Also available in 5-gal. containers and 55-gal. drums. Please call 800-482-4440 for more information.

Formulated for the wave soldering of conventional and surface mount circuit board assemblies, these extremely low solids content fluxes leave practically no residue which can interfere with post-solder electrical testing. Boards are dry and cosmetically clean as they exit the wave solder machine. With these environmentally safe fluxes, the expense of solvent or water cleaning is eliminated. No-clean fluxes provide good activity, are halogen-free and non-corrosive, don't degrade surface insulation resistance, and do not require removal in most applications. No offensive odors are given off during soldering. Water-based Formula 979 is free of any volatile organic compounds (VOCs), solvents that may react photochemically to form air pollution (smog). This flux's finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. Kester 979 also reduces micro-solderballing on glossy laminates and between connector pins. With a typical solids content of 2.9%, solvent-based Formula 959T leaves evenly distributed residues for the ideal cosmetic appearance. This flux's small percentage of rosin (0.5%) improves solderability, heat stability, and surface insulation resistance.

Lead-free wave and selective soldering require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuing reliable product output. They can be applied to circuit boards by a spray, foam, or dip process.

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