• For Stencil Printing Applications

A lead-free, organic acid, water soluble solder paste formula specifically designed for use with the higher temperature lead-free alloys. The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm / 20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP-coated and Immersion Gold over Electroless Nickel (ENIG) boards. Tin/silver/copper alloy: Sn96.5/Ag3.0/Cu0.5 (96.5% tin, 3.0% silver, and 0.5% copper, also referred to as Kester SAC 305). Powder mesh size: -325/+500 (Type 3). Metals content: 89.5%.

Note:
Solder paste jars and cartridges must be purchased in multiples of 10 units (standard package quantity).

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 Representative Description and Image
The description and image shown may not be not that of the actual part number R520ALF-600C. More.