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- For Stencil Printing Applications
A lead-free, air and nitrogen reflowable,
no-clean solder paste specifically designed for the
thermal requirements of lead-free alloys. The paste flux
system allows joint appearances that closely resemble
that achieved with Sn/Pb alloys. EM907 is capable of
stencil printing downtimes up to 60 minutes with an
effective first print down to 20 mils without any kneading.
EM907 also exhibits excellent continual printability for
fine pitch (0.4mm/16 mils) and is able to print at high
speeds up to 6"/sec. (150 mm/sec.). This solder paste
also exceeds the reliability standards required by J-STD-
004. Tin/silver/copper alloy: Sn96.5/Ag3.0/Cu0.5 (96.5% tin, 3.0% silver,
and 0.5% copper, also referred to as Kester SAC 305). Powder mesh size: -325/+500 (Type 3). Metals content: 88.5%.
Note:
Solder paste jars and cartridges must be purchased in multiples of 10 units (standard package quantity).
 View a printer-friendly PDF of this page from our Buyer's Guide product catalog.  Representative Image
The image shown may not be that of the actual part number EM907LF-500J. More.
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