• For Stencil Printing Applications

Specifically designed to exhibit long stencil life and tack time along with resistance to slump, while still delivering exceptional solderability to a wide variety of metallic substrates. The activator package in this formula is very aggressive, providing superior wetting to OSP coated PCBs and Ag/Pd components. HM531 is extremely stable and maintains its tackiness and printing characteristics for up to 8 hours and printer downtimes in excess of 60 minutes. Tin/lead alloy: Sn63/Pb37. Powder mesh size: -325/+500 (Type 3). Metals content: 90%.

Kester solder pastes are developed specifically to meet the requirements of surface mount applications on both standard glass-epoxy and hybrid circuitry. Rheological properties are fashioned to work smoothly with common dispensing methods while still meeting the restrictions of printed circuit pattern densities. Kester solder pastes can be used with a broad range of reflow techniques including infra-red, hot belt, or vapor phase. They contain high quality solder powder which is spherical, consistently sized, low in oxide content, and made from pure virgin metals. The solder power is suspended in flux vehicles which place special emphasis on eliminating solder balls and other common defects, while maintaining a minimum effect on electronic reliability.

Note:
Solder paste jars and cartridges must be purchased in multiples of 10 units (standard package quantity).

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 Representative Description and Image
The description and image shown may not be not that of the actual part number HM531-600C. More.