• For Syringe Dispensing Applications

Aggressive enough to remove tenacious oxide layers or solder to OSP-coated boards. Delivers excellent wetting characteristics. Tin/lead alloy: Sn63/Pb37. Powder mesh size: -325/+500 (Type 3). Metals content: 86%.

Kester solder pastes are developed specifically to meet the requirements of surface mount applications on both standard glass-epoxy and hybrid circuitry. Rheological properties are fashioned to work smoothly with common dispensing methods while still meeting the restrictions of printed circuit pattern densities. Kester solder pastes can be used with a broad range of reflow techniques including infra-red, hot belt, or vapor phase. They contain high quality solder powder which is spherical, consistently sized, low in oxide content, and made from pure virgin metals. The solder power is suspended in flux vehicles which place special emphasis on eliminating solder balls and other common defects, while maintaining a minimum effect on electronic reliability.

Note:
Solder paste syringes must be purchased in minimum quantities of 15 units.

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