Instant adhesive formulated specifically for PC board assembly and repair. Used to secure wires to printed circuit boards and coil forms, tamper-proof adjustable components, reinforce standoffs, and mount edge guides and stiffeners to circuit boards. Replaces epoxies, silicones, and hot melts. Simple to use. Just apply accelerator to board surface at point of wire contact, then apply a drop of adhesive over wire. Adhesive sets in just a few seconds at room temperature. Two formulas to choose from. Standard Tak PakŪ 444 is used for temperatures up to 180°F, and has a viscosity of 700 cP. Ultra-Performance Tak PakŪ 382 is a high-temperature (250°F), high viscosity (5,000 cP) adhesive that withstands severe thermal cycling and bake-in process steps. Both Tak Pak® adhesives are available individually in a 20-gm. bottle, or in a ready-to-use kit packaged with 7452 accelerator.

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