• User-selected temperature and air flow setback
• Temperature offset control that fine-tunes hot air temperature
• Closed-loop temperature feedback control maintains temperature at nozzle, independent of airflow rate

This station directs hot air precisely onto the legs of SMD components to melt the solder joint while preventing damage to the circuit board and adjacent components. Features include 650 watts of power, internal pump that adjusts air flow from 5 to 50 liters/min., and hot air temperature variable from 100°F to 1000°F. Temperature offset control fine-tunes the hot air temperature right at the tip when an ultra-precise temperature is required for thermocoupled component removal. A sensor located at the nozzle continuously samples the temperature and instantly adjusts the heat output to maintain the temperature you have pre-selected. Your rework production increases and your reject rate goes down because you don’t have to readjust the temperature every time you change the air flow rate. Station operates on 120VAC and is ESD-safe. Comes with power unit, HAP3 hot air handpiece with holder, power on-off switch, and power-on LED indicator. Interchangeable hot air nozzles must be purchased separately.