Engineered specifically for high temperature, lead-free solders. Can also be used with tin/lead solders. Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids. Non-corrosive ultra high purity, no-clean flux leaves no ionic contamination on circuit boards. Especially effective at removing residual solder from SMT pads. Packaged in ESD-safe static dissipative bobbins. RoHS compliant.