Presaturated with isopropyl alcohol to remove solder paste, inks, and other contaminants associated with SMT stencil printing. Ideal for touch-up cleaning of automatic printer stencils and for cleaning semi-automatic printer stencils during and at the end of production runs. High absorbency and liquid retention. Strong, will not tear, shred, unravel or lint. Holds up to rigorous scrubbing that is sometimes required to remover solder paste from SMT stencil surfaces. Safe for most plastics. Ozone safe, CFC/HCFC free.

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