Used for the removal and replacement of through-hole components, connectors, etc. mounted on PC boards.
Microprocessor based, digital controller regulates solder bath temperature to ±3°F, solder flow wave
height, solder flow cycle time, and excess solder thru" cycle time. "Blow-thru" hot air
nozzle option removes solder remaining in through-holes during rework process. Overhead locator laser
light pinpoints position for centering component over wave. Other features include 25 menu storage, LCD
display with membrane keypad, and adjustable table height. Solder capacity is 50 lbs. A large selection
of easy-to-change nozzles for all component sizes is available.
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Representative Description and Image
The description and image shown may not be not that of the actual part number GW10A. More.
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